The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Nov. 21, 2019
Applicant:

Shanghai Huali Microelectronics Corporation, Shanghai, CN;

Inventors:

Junjun Zhuang, Shanghai, CN;

Xu Chen, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2022.01); G06K 9/62 (2022.01); G06N 3/04 (2006.01); G01B 21/20 (2006.01); G06N 3/08 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00536 (2013.01); G06K 9/0051 (2013.01); G06K 9/00523 (2013.01); G06K 9/6218 (2013.01); G06N 3/04 (2013.01); G01B 21/20 (2013.01); G06N 3/08 (2013.01);
Abstract

The present invention provides a classification method for automatically identifying wafer spatial pattern distribution, comprising the following steps: performing statistical analysis to distribution of defects on a wafer, the defects being divided into random defects, repeated defects and cluster defects; performing denoising and signal enhancement to the cluster defects; performing feature extraction to the cluster defects after denoising and signal enhancement; and performing wafer spatial pattern distribution classification to the cluster defects after feature extraction. By performing statistical analysis and neural network training to a great amount of wafer defect distribution, the spatial patterns in defect distribution can be automatically identified, the automatic classification of wafer spatial patterns can be realized, the workload of engineers is effectively reduced and the tracing of the root cause of such spatial pattern is facilitated.


Find Patent Forward Citations

Zhuang, Junjun. (2022). Classification method for automatically identifying wafer spatial pattern distribution (U.S. Patent No. 11347959). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11347959

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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