The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Dec. 26, 2019
Applicant:

Feng Chia University, Taichung, TW;

Inventors:

Yu-Cheng Liu, Taichung, TW;

Jin-Huang Huang, Taichung, TW;

Jui-Chu Weng, Taichung, TW;

Tzu-Hsuan Lei, Taichung, TW;

Assignee:

FENG CHIA UNIVERSITY, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/30 (2020.01); G06F 30/20 (2020.01); H04R 29/00 (2006.01);
U.S. Cl.
CPC ...
G06F 30/30 (2020.01); G06F 30/20 (2020.01); H04R 29/00 (2013.01);
Abstract

The invention discloses a prediction method for porous material of electroacoustic devices and prediction system thereof. The method comprises the following steps. The step (A) is to obtain at least one acoustic parameter of a porous material from an electroacoustic device, and the at least one acoustic parameter comprises a flow resistance value, a specific flow resistance value and a flow resistance ratio. The step (B) is to calculate an actual resistance value of the porous material based on the at least one acoustic parameter. Thereafter, the step (C) establishes an equivalent circuit model corresponding to the electroacoustic device based on the structure configuration and material parameters of the electroacoustic device. At last, step (D) introduces the actual impedance value of the porous material into the equivalent circuit model, and calculates the frequency response curve and impedance curve of the electroacoustic device affected by the porous material.


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