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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11347146 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Aug. 30, 2017

Resin composition

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yuki Masuda, Otsu, JP;

Keika Hashimoto, Otsu, JP;

Ryoji Okuda, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
G03F 7/039 (2006.01); C08G 73/14 (2006.01); C09D 179/08 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); H01L 51/00 (2006.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); G03F 7/022 (2006.01); C08J 5/18 (2006.01); G03F 7/023 (2006.01); C08G 73/06 (2006.01); C08G 73/10 (2006.01); C08G 69/26 (2006.01);
U.S. Cl.
CPC ...
G03F 7/039 (2013.01); C08G 69/26 (2013.01); C08G 73/06 (2013.01); C08G 73/10 (2013.01); C08G 73/14 (2013.01); C08J 5/18 (2013.01); C09D 179/08 (2013.01); G03F 7/0226 (2013.01); G03F 7/0233 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 27/1248 (2013.01); H01L 27/3258 (2013.01); H01L 51/0018 (2013.01); H01L 51/0035 (2013.01); H01L 51/0043 (2013.01); H01L 51/56 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/13024 (2013.01); H01L 2227/323 (2013.01); H01L 2924/01029 (2013.01);
Abstract

The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

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