The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Mar. 13, 2020
Applicant:

Lem International SA, Plan-les-Ouates, CH;

Inventors:

Jean-François Lanson, Reignier-Esery, FR;

Dominik Schläfli, Nyon, CH;

Assignee:

LEM International SA, Plan-les-Ouates, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/07 (2006.01); G01R 33/00 (2006.01); G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01R 33/07 (2013.01); G01R 33/0094 (2013.01); G01R 33/09 (2013.01);
Abstract

A magnetic field sensor comprises a signal conditioning IC and a magnetic field sensor IC, the magnetic field sensor IC being mounted on and connected to the signal conditioning IC. The magnetic field sensor IC comprises a semi-conductor substrate with a sensor active layer disposed an outer facing side of the magnetic field sensor opposite the signal conditioning IC. The sensor active layer is connected to conductive vias that extend through the semi-conductor substrate from said outer facing side to an underside facing the signal conditioning IC, an underside of the conductive via being electrically interconnected to a connection pad on the signal conditioning IC via a chip-on-chip interconnection comprising a conductive bead connection and a solder connection.


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