The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Jan. 04, 2018
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Chihiro Kawahara, Chiyoda-ku, JP;

Takeshi Horiguchi, Chiyoda-ku, JP;

Yoshiko Tamada, Chiyoda-ku, JP;

Yasushi Nakayama, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01R 31/28 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/41 (2006.01); H01L 29/78 (2006.01); H01L 23/28 (2006.01); H01L 23/52 (2006.01); H01L 23/62 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2621 (2013.01); H01L 29/78 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49111 (2013.01);
Abstract

An increased accuracy in detecting deterioration of a semiconductor device can be achieved. A first metal pattern and a second metal pattern are connected to a controller. A bonding wire connects the first metal pattern and an emitter electrode. A linear conductor is connected between a first electrode pad and a second electrode pad. First bonding wires connect the first electrode pad and the second metal pattern. Second bonding wires connect the second electrode pad and the second metal pattern. The controller detects the deterioration of the semiconductor device when a potential difference between the first metal pattern and the second metal pattern is above a threshold.


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