The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Feb. 22, 2017
Applicant:

Halliburton Energy Services, Inc., Houston, TX (US);

Inventors:

Reza Khalaj Amineh, Houston, TX (US);

Ahmed E. Fouda, Spring, TX (US);

Burkay Donderici, Pasadena, CA (US);

Luis Emilio San Martin, Albuquerque, NM (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/90 (2021.01); G01V 3/12 (2006.01); G01V 3/28 (2006.01); E21B 47/085 (2012.01);
U.S. Cl.
CPC ...
G01N 27/9066 (2013.01); E21B 47/085 (2020.05); G01V 3/12 (2013.01); G01V 3/28 (2013.01);
Abstract

Apparatus and methods to investigate a multiple nested conductive pipe structure can be implemented in a variety of applications. An electromagnetic pulsed tool disposed in the multiple nested conductive pipe structure in a wellbore can make a set of log measurements and provide a measured log at different depths in the multiple nested conductive pipe structure. A test setup or library can provide a set of small defect log measurements. Processing circuitry can process the set of log measurements to generate thickness estimations of the multiple nested conductive pipes and processing circuitry can process the set of small defect log measurements to generate small defect thickness estimations. Processing circuitry can solve a system of equations involving the thickness estimations and the small defect thickness estimations to generate thickness variations for the multiple nested conducted pipes over the different depths. Additional apparatus, systems, and methods are disclosed.


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