The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Jun. 15, 2020
Applicant:

Sporian Microsystems, Inc., Lafayette, CO (US);

Inventors:

Kevin Harsh, Erie, CO (US);

Jon Lubbers, Lafayette, CO (US);

Evan Pilant, Longmont, CO (US);

Alex Brand, Westminster, CO (US);

Laura Ferlin, Erie, CO (US);

Samuel Hotaling, Boulder, CO (US);

Steve Sheeran, Longmont, CO (US);

Jakob Oreskovich, Boulder, CO (US);

Eric Schneider, Thornton, CO (US);

Thomas Schahrer, Longmont, CO (US);

Lewis Wright, Polson, MT (US);

Assignee:

Sporian Microsystems, Inc., Lafayette, CO (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01F 15/14 (2006.01); G01L 19/06 (2006.01); G01F 1/76 (2006.01); G01F 1/69 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
G01F 15/14 (2013.01); G01F 1/69 (2013.01); G01F 1/76 (2013.01); G01L 9/0075 (2013.01); G01L 19/0681 (2013.01);
Abstract

Heat resistant sensors equipped with any of a variety of transducers for measuring any of a variety of properties of fluids are constructed with components comprising materials that can withstand very high temperatures. Some embodiments of the sensors include a first pressure sensitive element and a second pressure sensitive element with respective first and second membranes positioned in juxtaposed relation to each other to form a capacitor. Some embodiments include a pusher that extends from the membrane toward a first electrode. Some embodiments have a housing comprising a ceramic substrate with a sensor element mounted on an inside surface of the substrate. Other embodiments have direction sensing capabilities including a heater positioned in a core material and at least three temperature sensors located at or near the peripheral surface of the core material and spaced apart angularly in relation to each other.


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