The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Jan. 23, 2020
Hitachi Astemo, Ltd., Hitachinaka, JP;
Shigeto Hirohata, Hitachinaka, JP;
Akira Uenodan, Hitachinaka, JP;
Nobuaki Gorai, Hitachinaka, JP;
Takahiro Miki, Hitachinaka, JP;
Nozomi Yatsumonji, Hitachinaka, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
Provided is a physical quantity detection device capable of achieving both rigidity improvement and sealability improvement. A physical quantity detection device () of the invention includes a housing (), a cover (), a chip package (), and a flow rate sensor () supported by the chip package and arranged in a sub-passage. The housing includes: a first adhesive grooveA which is an adhesive groove to which an adhesive for bonding the cover is applied, extends along a proximal end of the housing, extends in the protruding direction of the housing from the proximal end of the housing to a position on a more distal end side of the housing than the chip package, and is applied with the first adhesive; and a second adhesive grooveB which extends along the sub-passageand is applied with the second adhesive. The first adhesive has a higher Young's modulus, and the second adhesive has a higher thixotropy.