The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Apr. 18, 2019
Applicant:
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Dane Chang, Sugar Land, TX (US);
Condell Doyle, Lake Jackson, TX (US);
Assignee:
Dow Global Technologies LLC, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/08 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01); C08L 23/08 (2006.01);
U.S. Cl.
CPC ...
C08L 23/0815 (2013.01); B32B 1/08 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); B32B 2250/03 (2013.01); B32B 2262/101 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2597/00 (2013.01); C08L 2203/16 (2013.01); C08L 2203/18 (2013.01); C08L 2205/035 (2013.01); C08L 2207/062 (2013.01);
Abstract
A tie layer composition comprising from 60 wt. to 95 wt. % of a first polyethylene composition comprising a first molecular weight ethylene-based polymer component and a second molecular weight ethylene-based polymer component, wherein the polyethylene resin has a density from 0.940 to 0.960 g/cc and a melt index (I2) from 0.01 to 5 g/10 min; and from 5 wt. % to 40 wt. % of a second polyethylene composition comprising: (i) a high density polyethylene having a density greater than or equal to 0.940 g/cc; and (ii) a maleic-anhydride grafted polyethylene.