The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Dec. 11, 2018
Dow Global Technologies Llc, Midland, MI (US);
Stephanie M. Whited, Charleston, WV (US);
Siddharth Ram Athreya, Freeport, TX (US);
Mridula Kapur, Lake Jackson, TX (US);
Alexander Stolarz, Horgen, CH;
Adriana Velasquez, Missouri City, TX (US);
Dow Global Technologies LLC, Midland, MI (US);
Abstract
The present disclosure provides formulation. The formulation contains a high density polyethylene composition containing (i) a high molecular weight component including an ethylene/a-olefin copolymer, the high molecular weight component having a density from 0.924 to 0.930 g/cc and a high load melt index (121) from 0.3 to 0.9 g/10 min; and (ii) a low molecular weight component including an ethylene-based polymer selected from the group consisting of an ethylene homopolymer and an ethylene/a-olefin copolymer. The high density polyethylene composition has (a) a density from 0.950 to 0.956 g/cc; (b) a high load melt index (121) from 15 to 28 g/10 min; (c) an 121/12 of at least 85; (d) a notched constant tensile load failure time at 35% yield stress of greater than 90 hours; and (e) an environmental stress crack resistance (ESCR) F0 value, according to ASTM D1693—condition B (100% IGEPAL), of greater than 2,000 hours.