The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Jul. 30, 2020
Applicants:

South China Institute of Environmental Science, Mee, Guangdong, CN;

Chongqing Municipal Solid Waste Manaement Center, Chongqing, CN;

Zhixi Technology (Chongqing) Co., Ltd., Chongqing, CN;

Inventors:

JianWei Du, Guangdong, CN;

Kuang He, Guangdong, CN;

Na Tang, Chongqing, CN;

Wei Guan, Guangdong, CN;

Yan Jia, Guangdong, CN;

XiaoYing Hu, Guangdong, CN;

MingYang Zhang, Guangdong, CN;

MingShan Li, Guangdong, CN;

Ning Huang, Chongqing, CN;

Feng Xu, Chongqing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C02F 1/46 (2006.01); B01J 23/72 (2006.01); B01J 35/00 (2006.01); B01J 37/04 (2006.01); B01J 37/08 (2006.01); C02F 1/00 (2006.01); C02F 1/44 (2006.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); C02F 1/467 (2006.01); C02F 1/461 (2006.01); C02F 101/20 (2006.01); C02F 103/16 (2006.01);
U.S. Cl.
CPC ...
C02F 1/4678 (2013.01); B01J 23/72 (2013.01); B01J 35/006 (2013.01); B01J 37/04 (2013.01); B01J 37/08 (2013.01); C02F 1/001 (2013.01); C02F 1/447 (2013.01); C02F 1/4672 (2013.01); C02F 1/46109 (2013.01); C23C 18/1617 (2013.01); C02F 2001/46152 (2013.01); C02F 2101/20 (2013.01); C02F 2103/16 (2013.01); C02F 2201/4614 (2013.01); C02F 2209/02 (2013.01); C02F 2209/06 (2013.01); C02F 2209/08 (2013.01); C23C 18/38 (2013.01);
Abstract

The disclosure discloses an online resourceful treatment method of electroless copper plating waste solution. According to the disclosure, a copper catalyst is adopted to perform autocatalytic reaction on electroless copper plating waste solution in an autocatalytic reactor, copper simple substances are reduced from copper ions in the waste solution and recycled, the treated waste solution enters into a three-dimensional electrolyzer and a membrane filtration plant for further purification, the finally treated electroless copper plating waste solution meets water quality discharge standard, and the recovery rate of the copper simple substances can reach up to above 95%.


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