The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Aug. 19, 2020
Honda Motor Co., Ltd., Tokyo, JP;
Continental Automotive Gmbh, Hannover, DE;
Sunarrow Ltd, Tokyo, JP;
Seonghun Lee, Wako, JP;
Ryo Sato, Tokyo, JP;
Tomoomi Kiyomiya, Tokyo, JP;
YoungJin Hyun, Boon Keng Road, SG;
Takezo Takahata, Boon Keng Road, SG;
HONDA MOTOR CO., LTD., Tokyo, JP;
Continental Automotive GmbH, Hannover, DE;
SUNARROW LTD, Tokyo, JP;
Abstract
A resin molded article is equipped with a resin base material layer, a cover layer, and a design layer. The design layer is provided on a design side end surface of the resin base material layer, whereas the cover layer is provided on a cover side end surface which is a rear surface of the design side end surface. Further, the cover layer includes a first end surface facing toward the cover side end surface, and a second end surface which is a rear surface of the first end surface. The first end surface is covered by a first coating layer, and the second end surface is covered by a second coating layer.