The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Aug. 08, 2017
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Ryuichi Narita, Tokyo, JP;

Toshiya Watanabe, Tokyo, JP;

Akio Kondou, Tokyo, JP;

Hidetaka Haraguchi, Tokyo, JP;

Shuji Tanigawa, Tokyo, JP;

Masashi Kitamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/85 (2021.01); B22F 10/38 (2021.01); B22F 10/28 (2021.01); B22F 10/368 (2021.01); G01B 11/25 (2006.01); G01N 21/95 (2006.01); B22F 3/16 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B22F 10/85 (2021.01); B22F 10/28 (2021.01); B22F 10/368 (2021.01); B22F 10/38 (2021.01); G01B 11/25 (2013.01); G01N 21/95 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

A three-dimensional additive manufacturing device is configured to emit a beam to a powder bed formed by laying a powder on a base plate to harden the powder bed selectively. A sensor is configured to detect the shape or the temperature of a surface of the powder bed or a modeling surface. A defect in laying of the powder or a defect in emission of the beam is corrected based on the detection result, before completion of forming of the next layer.


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