The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Mar. 29, 2018
Applicant:

Asti Corporation, Hamamatsu, JP;

Inventors:

Noriyuki Ogai, Hamamatsu, JP;

Masahiro Takigawa, Kyoto, JP;

Assignee:

ASTI CORPORATION, Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 37/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); A61M 2037/003 (2013.01); A61M 2037/0023 (2013.01); A61M 2037/0053 (2013.01);
Abstract

The purpose of the present invention is to provide a microneedle array and a microneedle manufacturing method, which improves medical solution delivery efficiency and facilitates manufacturing. The microneedle array is provided with a first divisional element, a second divisional element to be bonded to the first divisional element, a longitudinal passage formed between the first divisional element and the second divisional element bonded to each other; and a horizontal hole, having an orifice on a lateral side and formed in a direction parallel to a bonding surface of the first divisional element with the second divisional element, and communicating to the longitudinal passage.


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