The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

May. 14, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yu Kishiwada, Tokyo, JP;

Yasuhiko Kitamura, Tokyo, JP;

Hiroaki Takahashi, Tokyo, JP;

Shogo Matsuoka, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/3675 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H05K 1/0204 (2013.01); H05K 7/20927 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10431 (2013.01);
Abstract

The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.


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