logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11342489 B1

PDFFull Text
Date of Patent:
May. 24, 2022

Filed:

Jun. 23, 2016

Method of surface-mounting components

Applicant:

Dst Innovations Limited, Bridgend, GB;

Inventors:

Anthony Miles, Bridgend, GB;

Benjamin Masheder, Portishead, GB;

Assignee:

DST Innovations Limited, Bridgend, GB;

Attorney:

McCarter & English, LLP

Primary Examiner:

Stephen M Bradley

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H01L 33/00 (2010.01); H01L 33/58 (2010.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/5387 (2013.01); H01L 23/544 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/0093 (2020.05); H01L 33/58 (2013.01); H05K 1/189 (2013.01); H05K 3/007 (2013.01); H05K 3/323 (2013.01); H01L 23/4985 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H05K 2203/1545 (2013.01); H05K 2203/166 (2013.01);
Abstract

A method of connecting a plurality of electronic components to a flexible circuit board comprises: providing a carrier substrate carrying the electronic components, each of the electronic components having at least one electrical contact coated with electrically conductive adhesive; and applying the carrier substrate to the flexible circuit board such that the electronic components are adhered to the flexible circuit board in electrical contact therewith via the conductive adhesive. The electronic components may comprise LEDs and there may be provided one or more optical layers over the flexible circuit board.

Find Patent Forward Citations

Loading…