The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Apr. 04, 2018
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventor:

Keiichi Sawai, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81193 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06558 (2013.01);
Abstract

A semiconductor device is provided with a first semiconductor chip and a second semiconductor chip that are arranged so as to oppose each other. The first semiconductor chip has a first connecting portion provided in a first hole portion, and the second semiconductor chip has an electrically conductive second connecting portion that is composed of a concave metal film formed on the front surface of a second electrode portion, the side surface of a second hole portion, and the front surface of a second protective film. The first electrode portion and the second electrode portion are electrically connected via the first connecting portion and the second connecting portion.


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