The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Aug. 25, 2020
Applicant:
Japan Display Inc., Tokyo, JP;
Inventors:
Youhei Iwai, Tokyo, JP;
Hideaki Abe, Tokyo, JP;
Assignee:
JAPAN DISPLAY INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 21/3043 (2013.01); H01L 21/78 (2013.01); H01L 23/3171 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/10158 (2013.01);
Abstract
The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.