The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Sep. 03, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Daisuke Kimura, Kanagawa, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/60 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 24/48 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/30205 (2013.01);
Abstract
A semiconductor device includes a substrate, a semiconductor chip, and a sealing member. The semiconductor chip is disposed on the substrate. The semiconductor chip includes a first principal surface on a side of the substrate and a second principal surface on a side opposite to the first principal surface. The sealing member seals the semiconductor chip. The sealing member includes a first sealing member and a second sealing member. The second sealing member faces at least a part of the second principal surface. A permittivity of the second sealing member is lower than a permittivity of the first sealing member.