The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Aug. 20, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Charles G. Potter, Santa Clara, CA (US);
Terrance Allen Neal, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01D 5/24 (2006.01); G01H 1/00 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); G01D 5/24 (2013.01); G01H 1/00 (2013.01); H01L 21/68742 (2013.01);
Abstract
Embodiments disclose herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the first surface, wherein the sensor regions comprise self-referencing capacitive sensors. In an embodiment, the sensor wafer further comprises a vibration sensor embedded within the substrate.