The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Jun. 19, 2018
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventor:
Kwang Sun Choi, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/36 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01); H01F 3/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/2804 (2013.01); H01F 27/32 (2013.01); H01F 27/324 (2013.01); H01F 27/36 (2013.01); H01F 2003/106 (2013.01);
Abstract
A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.