The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Mar. 15, 2017
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Eerik J. Helmick, Seattle, WA (US);

Bradley J. Mitchell, Snohomish, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/04 (2006.01); G05B 19/19 (2006.01); H01R 43/02 (2006.01); H01R 43/28 (2006.01); H01R 43/05 (2006.01);
U.S. Cl.
CPC ...
G05B 19/19 (2013.01); H01R 43/0228 (2013.01); G05B 2219/37582 (2013.01); H01R 43/05 (2013.01); H01R 43/28 (2013.01);
Abstract

Systems and methods are provided for wire processing. In certain examples, a wire processing system is disclosed. The wire processing system includes an electrical wire and solder sleeve joining system. The electrical wire and solder sleeve joining system includes an end effector configured to hold a solder sleeve and a split funnel configured to guide insertion of wire into the solder sleeve, allow movement of the solder sleeve through the split funnel in a second position, and prevent movement of the solder sleeve through the split funnel in a first position. The end effector can additionally be configured to remove a slug from the wire.


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