The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Oct. 07, 2020
Applicant:

Senko Advanced Components, Inc., Marlborough, MA (US);

Inventors:

Kazuyoshi Takano, Tokyo, JP;

Gang Xu, Kowloon, HK;

Tomoyuki Mamiya, Tokyo, JP;

Assignee:

Senko Advanced Components, Inc., Marlborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); G02B 6/04 (2006.01);
U.S. Cl.
CPC ...
G02B 6/3636 (2013.01); G02B 6/04 (2013.01); G02B 6/3696 (2013.01);
Abstract

A fiber array device configured to secure and align one or more optical fiber bundles as part of a main body using a fixing material. The fixing material is light cured or room temperature cured. Main body forms an angle from a first direction along a second direction, and a recess the optical bundles are laid within and in which the fixing material is applied. Each individual optical fiber is laid within a groove formed in a lid, the base portion or both the lid and the base portion. The fiber array device is secured to a printed circuit board to form a communication path between the optical fiber and electronics of the board.


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