The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Sep. 17, 2019
Applicant:

Zhejiang Future Technology Institute (Jiaxing), Jiaxing, CN;

Inventors:

Shuangwen Liu, Jiaxing, CN;

Lei Liu, San Ramon, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); G01N 29/22 (2006.01); G01N 29/24 (2006.01); G01N 29/28 (2006.01); G01K 13/00 (2021.01); G01N 29/12 (2006.01); G01B 17/02 (2006.01); G01N 17/04 (2006.01); G01N 29/07 (2006.01);
U.S. Cl.
CPC ...
G01N 29/043 (2013.01); G01B 17/02 (2013.01); G01K 13/00 (2013.01); G01N 17/04 (2013.01); G01N 29/07 (2013.01); G01N 29/12 (2013.01); G01N 29/223 (2013.01); G01N 29/228 (2013.01); G01N 29/2437 (2013.01); G01N 29/2462 (2013.01); G01N 29/28 (2013.01); G01N 2291/011 (2013.01); G01N 2291/023 (2013.01); G01N 2291/02854 (2013.01); G01N 2291/102 (2013.01); G01N 2291/2698 (2013.01);
Abstract

The present invention discloses ultrasonic nondestructive methods for pipe wall thickness measurement at high or low temperatures. An ultrasonic detection device comprises a first and a second ultrasonic waveguide. The waveguide length is selected according to the surface temperature of a pipe under inspection. A first piezoelectric plate causes generation of a plurality of ultrasonic excitation signals which is transmitted to the pipe through the first ultrasonic waveguide. The plurality of ultrasonic excitation signals has different group speeds when traveling along the first ultrasonic waveguide. The reflected ultrasonic wave signals are collected and transmitted to a second piezoelectric plate by the second ultrasonic waveguide. The pipe wall thickness is calculated using an ultrasonic wave signal which has the highest group speed. The first and second waveguides are arranged parallel and side by side. An isolation plate is disposed such that the first and second waveguides go through the plate perpendicularly.


Find Patent Forward Citations

Liu, Shuangwen. (2022). Methods and systems for pipe wall thickness detection (U.S. Patent No. 11340195). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11340195

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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