The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

May. 29, 2020
Applicant:

Zhuhai Bojay Electronics Co. Ltd., Guangdong, CN;

Inventors:

Xiwan Shan, Guangdong, CN;

Tuxiu Yang, Guangdong, CN;

Yundong Ai, Guangdong, CN;

Jie Zhang, Guangdong, CN;

Qunlin Li, Guangdong, CN;

Qiming Liu, Guangdong, CN;

Su Yan, Guangdong, CN;

Yanyong Liu, Guangdong, CN;

Junchao He, Guangdong, CN;

Jiahui Cai, Guangdong, CN;

Yue Chen, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 23/00 (2015.01); F21S 4/26 (2016.01); H05K 1/18 (2006.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 23/001 (2013.01); F21S 4/26 (2016.01); H05K 1/181 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H05K 2201/10106 (2013.01);
Abstract

An LED hose lamp includes: an LED string light including a first conducting wire, a second conducting wire, a third conducting wire, a plurality of SMD LEDs and a plurality of encapsulation colloids, wherein a plurality of first and second welding spots are formed by removing insulation layers of the first and second conducting wire at intervals of a predetermined distance along axial directions of the first and second conducting wires respectively, two welding legs of each SMD LED are respectively welded onto a first welding spot and a second welding spot, the plurality of encapsulation colloids respectively coat the plurality of SMD LEDs and surfaces of portions of the third conducting wire corresponding to positions of the plurality of the SMD LEDs; and a soft tube coating outside the first conducting wire, the second conducting wire, the third conducting wire and the encapsulation colloid through an injection molding.


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