The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Jun. 26, 2019
Applicant:
Skc Co., Ltd., Gyeonggi-do, KR;
Inventors:
Dae Seong Oh, Seoul, KR;
Dawoo Jeong, Gyeonggi-do, KR;
Sunhwan Kim, Incheon, KR;
Jin Woo Lee, Gyeonggi-do, KR;
Dong Jin Lim, Gyeonggi-do, KR;
Assignee:
SKC CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08K 3/36 (2006.01); C08L 79/08 (2006.01); C08J 5/18 (2006.01); C08G 73/14 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1007 (2013.01); C08G 73/14 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08L 79/08 (2013.01); C08K 2201/005 (2013.01); C08L 2203/16 (2013.01);
Abstract
Embodiments provide a polyamide-imide polymer film, which comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound; and silica particles, wherein the number of aggregates having an average diameter of 150 to 200 nm observed in a cross-section cut in the thickness direction of the polyamide-imide film is less than 0.5/μm, and a process for preparing the same.