The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Dec. 03, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Anthony D. Studer, Corvallis, OR (US);

Quinton B. Weaver, Corvallis, OR (US);

David N. Olsen, Corvallis, OR (US);

James Michael Gardner, Corvallis, OR (US);

James William Ring, Corvallis, OR (US);

David Owen Roethig, Vancouver, OR (US);

Christopher Hans Bakker, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/175 (2006.01); B41J 2/045 (2006.01); G06F 13/42 (2006.01); G06F 21/44 (2013.01); G06F 1/12 (2006.01); G06F 1/08 (2006.01); H03K 19/0175 (2006.01); B33Y 30/00 (2015.01); B29C 64/259 (2017.01); G06F 3/12 (2006.01); G01F 23/24 (2006.01); G01F 23/80 (2022.01);
U.S. Cl.
CPC ...
B41J 2/17546 (2013.01); B29C 64/259 (2017.08); B33Y 30/00 (2014.12); B41J 2/0458 (2013.01); B41J 2/04508 (2013.01); B41J 2/04541 (2013.01); B41J 2/04546 (2013.01); B41J 2/04563 (2013.01); B41J 2/04586 (2013.01); B41J 2/1753 (2013.01); B41J 2/17513 (2013.01); B41J 2/17526 (2013.01); B41J 2/17566 (2013.01); G01F 23/247 (2013.01); G01F 23/802 (2022.01); G01F 23/804 (2022.01); G06F 1/08 (2013.01); G06F 1/12 (2013.01); G06F 3/121 (2013.01); G06F 13/4291 (2013.01); G06F 21/44 (2013.01); H03K 19/017509 (2013.01); G06F 13/42 (2013.01); G06F 2213/0016 (2013.01);
Abstract

This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.


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