The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Jun. 09, 2017
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Fengyi Su, Shanghai, CN;

Andong Liu, Shanghai, CN;

Hongyu Chen, Shanghai, CN;

Jianping Pan, Beijing, CN;

Xiao Bing Yun, Beijing, CN;

Thomas Allgeuer, Horgen, CH;

Erqiang Chen, Beijing, CN;

Tipeng Zhao, Beijing, CN;

Guihong Liao, Shanghai, CN;

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/36 (2006.01); C08K 5/092 (2006.01); C08K 5/20 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/36 (2013.01); C08K 5/092 (2013.01); C08K 5/20 (2013.01); B32B 2250/24 (2013.01); B32B 2307/31 (2013.01); B32B 2307/518 (2013.01); B32B 2307/744 (2013.01); B32B 2553/00 (2013.01);
Abstract

Provided is a coextruded multilayer film. The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C. The second layer contains a second ethylene-based polymer. Also provided is a laminate containing said sealant layer.


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