The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Jul. 09, 2018
Applicant:

Grabit, Inc., Sunnyvale, CA (US);

Inventors:

Harsha Prahlad, Cupertino, CA (US);

Richard J. Casler, Los Gatos, CA (US);

Susan Kim, Menlo Park, CA (US);

Matthew Leettola, San Jose, CA (US);

Jon Smith, San Jose, CA (US);

Kenneth Tan, San Jose, CA (US);

Patrick Wang, San Jose, CA (US);

John Mathew Farren, Beaverton, OR (US);

Patrick Conall Regan, Beaverton, OR (US);

Po Cheng Chen, Taichung, TW;

Howard Fu, Beaverton, OR (US);

Dragan Jurkovic, Beaverton, OR (US);

Aishwarya Varadhan, Beaverton, OR (US);

Chang-Chu Liao, Douliu, TW;

Chih-Chi Chang, Douliu, TW;

Kuo-Hung Lee, Douliu, TW;

Ming-Feng Jean, Douliu, TW;

Assignee:

Grabit, Inc., Ada, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/00 (2006.01); B25J 9/00 (2006.01); B25J 19/02 (2006.01); B25J 15/06 (2006.01); B25J 9/16 (2006.01); B23P 19/00 (2006.01); B32B 37/18 (2006.01); B25H 1/20 (2006.01); H02N 13/00 (2006.01); B23P 21/00 (2006.01); B32B 38/18 (2006.01); A43D 111/00 (2006.01);
U.S. Cl.
CPC ...
B25J 15/0085 (2013.01); B23P 19/007 (2013.01); B25H 1/20 (2013.01); B25J 9/0093 (2013.01); B25J 9/0096 (2013.01); B25J 9/1697 (2013.01); B25J 15/065 (2013.01); B25J 15/0616 (2013.01); B25J 15/0666 (2013.01); B25J 19/023 (2013.01); B32B 37/18 (2013.01); H02N 13/00 (2013.01); A43D 111/003 (2013.01); B23P 21/00 (2013.01); B32B 2038/1891 (2013.01); B32B 2309/70 (2013.01);
Abstract

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.


Find Patent Forward Citations

Loading…