The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Jun. 08, 2018
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Thomas Anthony, Palo Alto, CA (US);
Seongsik Chang, Palo Alto, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B22F 12/00 (2021.01); B22F 10/50 (2021.01);
U.S. Cl.
CPC ...
B22F 10/50 (2021.01); B22F 12/00 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract
A system for compacting layers of metal powder, including: a layer of metal powder at a first voltage; and a conductive object above the layer of metal powder, the conductive object at a second voltage, wherein a voltage differential between the layer of metal powder and the conductive object is sufficient to attract particles from the layer of metal powder to the conductive object, change the voltage on the particles, and redeposit the particles in the layer of metal powder.