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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11338319 B1

PDFFull Text
Date of Patent:
May. 24, 2022

Filed:

Aug. 28, 2019

Gas cushion apparatus and techniques for substrate coating

Applicant:

Kateeva, Inc., Newark, CA (US);

Inventors:

Alexander Sou-Kang Ko, Santa Clara, CA (US);

Justin Mauck, Belmont, CA (US);

Eliyahu Vronsky, Los Altos, CA (US);

Conor F. Madigan, San Francisco, CA (US);

Eugene Rabinovich, Fremont, CA (US);

Nahid Harjee, Sunnyvale, CA (US);

Christopher Buchner, Sunnyvale, CA (US);

Gregory Lewis, Mountain View, CA (US);

Assignee:

KATEEVA, INC., Newark, CA (US);

Attorney:

Hauptman Ham LLP

Primary Examiner:

Robert A Vetere

Int. Cl.
CPC ...
B05D 3/06 (2006.01); B05D 3/02 (2006.01); H01L 51/00 (2006.01); B41J 3/407 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); B05C 15/00 (2006.01); B05C 13/00 (2006.01); C23C 14/00 (2006.01); H01L 23/532 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
B05D 3/065 (2013.01); B05C 13/00 (2013.01); B05C 15/00 (2013.01); B05D 3/0254 (2013.01); B41J 3/407 (2013.01); C23C 14/00 (2013.01); H01L 21/6715 (2013.01); H01L 21/67017 (2013.01); H01L 21/6776 (2013.01); H01L 21/67161 (2013.01); H01L 21/67196 (2013.01); H01L 21/67207 (2013.01); H01L 21/67248 (2013.01); H01L 21/67259 (2013.01); H01L 21/67276 (2013.01); H01L 21/67739 (2013.01); H01L 21/67748 (2013.01); H01L 21/67784 (2013.01); H01L 21/67787 (2013.01); H01L 21/6838 (2013.01); H01L 51/00 (2013.01); H01L 21/4867 (2013.01); H01L 23/5328 (2013.01); H01L 2924/0002 (2013.01); H05K 3/0091 (2013.01);
Abstract

A method of forming a material layer on a substrate comprises loading a substrate into a printing zone of a coating system using a substrate handler, printing an organic ink material on a substrate while the substrate is located in the printing zone, transferring the substrate from the printing zone to a treatment zone of the coating system, treating the organic ink material deposited on the substrate in the treatment zone to form a film layer on the substrate, and removing the substrate from the treatment zone using the substrate handler.

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