The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

May. 18, 2018
Applicant:

Ifp Energies Nouvelles, Rueil-Malmaison, FR;

Inventors:

David Berthout, Vaugneray, FR;

Bogdan Harbuzaru, Simandres, FR;

Eric Llido, Communay, FR;

Assignee:

IFP Energies Nouvelles, Rueil-Malmaison, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C01B 39/54 (2006.01); B01J 29/85 (2006.01); B01D 53/94 (2006.01); B01J 35/04 (2006.01); B01J 37/02 (2006.01); B01J 37/30 (2006.01); F01N 3/20 (2006.01); F01N 3/28 (2006.01);
U.S. Cl.
CPC ...
B01J 29/85 (2013.01); B01D 53/9418 (2013.01); B01J 35/04 (2013.01); B01J 37/0215 (2013.01); B01J 37/30 (2013.01); C01B 39/54 (2013.01); F01N 3/2066 (2013.01); F01N 3/28 (2013.01); F01N 3/2828 (2013.01); B01D 2255/20761 (2013.01); B01D 2255/50 (2013.01); B01D 2255/9155 (2013.01); B01J 2229/186 (2013.01); C01P 2002/72 (2013.01); C01P 2004/03 (2013.01); F01N 2330/06 (2013.01); F01N 2370/04 (2013.01); F01N 2510/063 (2013.01); F01N 2610/02 (2013.01); F01N 2610/04 (2013.01);
Abstract

The invention concerns a process for preparing a copper-comprising SAPO material with AFX structure, comprising at least the steps of mixing, in an aqueous medium, at least one aluminum source, at least one silicon source, at least one copper source, at least one phosphorus source, a TETA complexing agent and a TMHD structuring agent, in order to obtain a gel, and hydrothermal treatment of said gel with a shear rate of less than 50 sin order to obtain crystallization of said copper-comprising SAPO material with AFX structure.


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