The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Nov. 02, 2018
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Tatsuo Hasegawa, Tokyo, JP;

Toshikazu Yamada, Ibaraki, JP;

Ken Matsuoka, Ibaraki, JP;

Ayano Katou, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 3/12 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); H05K 1/034 (2013.01); H05K 1/095 (2013.01); H05K 1/097 (2013.01); H05K 3/1208 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0317 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0522 (2013.01); Y10T 428/31678 (2015.04);
Abstract

A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.


Find Patent Forward Citations

Hasegawa, Tatsuo. (2022). Laminate, method for producing the same, and method for forming conductive pattern (U.S. Patent No. 11337316). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11337316

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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