The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Apr. 22, 2019
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Nobuaki Miyamoto, Ibaraki, JP;
Atsushi Miki, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H01L 21/56 (2006.01); B21D 37/01 (2006.01); B23B 27/14 (2006.01); C03C 17/10 (2006.01); C03C 17/34 (2006.01); C03C 17/36 (2006.01); C23C 28/04 (2006.01); C23C 14/06 (2006.01); E06B 3/67 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C25D 5/00 (2006.01); C25D 5/12 (2006.01); H05K 3/06 (2006.01); C22C 9/04 (2006.01); C25D 5/14 (2006.01); C25D 3/04 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 3/56 (2006.01); C25D 11/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/384 (2013.01); B32B 15/01 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); C22C 9/04 (2013.01); C25D 5/12 (2013.01); C25D 5/605 (2020.08); C25D 5/627 (2020.08); H05K 1/09 (2013.01); H05K 3/022 (2013.01); H05K 3/06 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C25D 3/04 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); C25D 5/14 (2013.01); C25D 11/38 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0307 (2013.01);
Abstract
A surface treated copper foilincludes a copper foil, and a first surface treatment layerformed on one surface of the copper foil. The first surface treatment layerof the surface treated copper foilhas a root mean square gradient of roughness curve elements RΔq according to JIS B0601:2013 of 5 to 28°. A copper clad laminateincludes the surface treated copper foiland an insulating substrateadhered to the first surface treatment layerof the surface treated copper foil