The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Sep. 08, 2020
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventor:

Ping Mei, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); H01L 21/481 (2013.01); H01L 23/4985 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/189 (2013.01); H05K 3/22 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H05K 1/038 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0776 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1461 (2013.01);
Abstract

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.


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