The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Dec. 30, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dongsuk Jung, Suwon-si, KR;

Sukkyung Yoon, Suwon-si, KR;

Eunseok Yang, Suwon-si, KR;

Daejun Kang, Suwon-si, KR;

Keonyoung Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H04W 8/18 (2009.01); H04W 60/00 (2009.01); H04W 76/15 (2018.01); H04W 8/24 (2009.01);
U.S. Cl.
CPC ...
H04W 8/183 (2013.01); H04W 8/24 (2013.01); H04W 60/00 (2013.01); H04W 76/15 (2018.02);
Abstract

An electronic device may include a first subscriber identity module (SIM), a second SIM, a communication circuit, a memory, and a processor. According to an embodiment, the memory may store instructions that when executed, cause the processor to set the first SIM to a SIM associated with a data service, and the second SIM to a SIM irrelevant to the data service to determine first capability information associated with a function supported by the electronic device in connection with the first SIM, and second capability information associated with a function supported by the electronic device in connection with the second SIM. The instructions may also cause the processor to transmit the first and second capability information to the network, and to receive allocation of a resource for wireless communication corresponding to each of the first and second SIM from the network, based on the first and the second capability information.


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