The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Nov. 05, 2018
Applicants:

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jinyu Ren, Beijing, CN;

Yongzhi Song, Beijing, CN;

Bo Zhou, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 51/52 (2006.01); B32B 37/12 (2006.01); B32B 37/06 (2006.01); B32B 37/14 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); B32B 37/1207 (2013.01); B32B 37/1292 (2013.01); B32B 37/144 (2013.01); H01L 21/67115 (2013.01); H01L 21/67126 (2013.01); H01L 51/524 (2013.01); H01L 51/5246 (2013.01); B32B 2037/1253 (2013.01); B32B 2457/206 (2013.01);
Abstract

An irradiation assembly is provided, which is configured to heat and cure a package piece having a first region and a second region, the first region having a first adhesive material therein and the second region having a second adhesive material therein different from the first adhesive material, the irradiation assembly comprising: a light source assembly, configured to emit a first light heating the first adhesive material and to emit a second light curing the second adhesive material; and the package piece is an assembly configured to encapsulate electronic components accommodated therein, the first region is provided with the electronic components and is filled up with the first adhesive material encapsulating the electronic components, and the second region is arranged at periphery of the first region and is filled with the second adhesive material surrounding the first adhesive material.


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