The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Dec. 19, 2018
Applicant:
Lumileds Llc, San Jose, CA (US);
Inventors:
Danielle Russell Chamberlin, Belmont, CA (US);
Erik Maria Roeling, Son, NL;
Sumit Gangwal, San Jose, CA (US);
Niek Van Leth, Valdenswaard, NL;
Oleg Borisovich Shchekin, San Francisco, CA (US);
Assignee:
Lumileds LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/46 (2010.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/60 (2010.01); H01L 33/32 (2010.01); H01L 33/38 (2010.01); G09G 3/32 (2016.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); G09G 3/32 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0091 (2013.01);
Abstract
An optical isolation material may be applied to walls of a first cavity and a second cavity in a wafer mesh. A wavelength converting layer may be deposited into the first cavity to create a first segment and into the second cavity to create a second segment. The first segment may be attached to a first light emitting device to create a first pixel and the second segment to a second light emitting device to create a second pixel. The wafer mesh may be removed.