The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Mar. 03, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Osamu Yamaguchi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency moduleincludes: a substrate; a first componentmounted on an upper surfaceof the substrate; a second componentmounted on a lower surfaceof the substrate; an upper sealing resin layerand a lower sealing resin layer; a conductor pin; and a shield layer. The conductor pinincludes a terminal portionexposed from a lower surfaceof the lower sealing resin layerand connected to a ground electrode of an outer substrate, and a shield connection portionexposed from a side surfaceof the lower sealing resin layerand connected to the shield layer. As a result of the terminal portionof the conductor pinbeing connected to the ground electrode, the shield layeris connected to a ground potential with the shortest distance therebetween.