The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Dec. 16, 2019
Applicants:
Mianyang Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Assignees:
Mianyang BOE Optoelectronics Technology Co., Ltd., Sichuan, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); G06F 3/041 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G06F 3/0412 (2013.01); H01L 21/486 (2013.01); H01L 21/76816 (2013.01);
Abstract
A via hole structure includes: a first conductive layer, an interlayer insulating layer, and a second conductive layer that are sequentially arranged, wherein the interlayer insulating layer is provided with a via hole, the second conductive layer is overlapped with the first conductive layer by the via hole, and at least part of a surface, in contact with the second conductive layer, of the interlayer insulating layer is uneven.