Method of producing heat-dissipating unit

Abstract

[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost. [Solution] The method of producing a heat-dissipating unitincludes: inserting pinspunched out of a second plate memberfor pins into a plurality of through-holesformed in a first plate memberfor a substrate. In the first plate member, a plurality of substrate forming portionsis provided side by side in the longitudinal direction of the first plate member. In the second plate member, a plurality of pin punch-out portionsis provided side by side in the longitudinal direction of the second plate member. The method includes: a step A of forming the through-holesin the substrate forming portionof the first plate member; a step B of subjecting the pin punch-out portionof the second plate memberto a half-punch out process to form half-punched-out pin forming portionsprotruding from one surface side of the second plate member; a step C of forming the pinsby punching out the pin forming portionsfrom the second plate memberand simultaneously inserting the pinsinto the through-holesin the first plate member; and a step D of forming a substrate by cutting the substrate forming portionwith the pinsinserted in the through-holesfrom the first plate member