The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Feb. 14, 2018
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Masami Juta, Omi-Hachiman, JP;

Daisuke Sakumoto, Omi-Hachiman, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/047 (2006.01); H01L 23/10 (2006.01); H01S 5/02216 (2021.01); H01L 23/498 (2006.01); H01S 5/02251 (2021.01); H01L 23/66 (2006.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/047 (2013.01); H01L 23/10 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01S 5/02216 (2013.01); H01L 23/66 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 2223/6627 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1715 (2013.01); H01S 5/02251 (2021.01);
Abstract

An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the groove. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.


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