The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Aug. 04, 2020
Applicant:

Eryn Smith, Danville, CA (US);

Inventor:

Eryn Smith, Danville, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01);
Abstract

A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive wafer. A dielectric thin film is superimposed across the bonding surface of MESC in order to adjust the relative permittivity between the semiconductive wafer to the MESC. This adjustment in the relative permittivity allows the MESC to further adhere the semiconductive wafer to the MESC.


Find Patent Forward Citations

Smith, Eryn. (2022). System and method for adhering a semiconductive wafer to an electrostatic carrier by adjusting relative permittivity (U.S. Patent No. 11335581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11335581

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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