The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Dec. 23, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Shinya Onodera, Tokyo, JP;

Takehisa Tamura, Tokyo, JP;

Atsushi Takeda, Tokyo, JP;

Yuichi Nagai, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/248 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/248 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01);
Abstract

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.


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