The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Jan. 25, 2016
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/40 (2006.01); C08G 69/32 (2006.01); C07C 209/74 (2006.01); C07C 231/02 (2006.01); C07D 209/48 (2006.01); C07D 263/62 (2006.01); C07C 231/12 (2006.01); H01L 21/027 (2006.01); C07C 41/22 (2006.01); H01L 23/31 (2006.01); H05K 3/34 (2006.01); C07C 213/00 (2006.01); C07C 211/56 (2006.01); C08G 73/10 (2006.01); G03F 7/037 (2006.01); C09D 179/08 (2006.01); C07C 67/307 (2006.01); C07C 269/06 (2006.01); C09D 179/04 (2006.01); G03F 7/039 (2006.01); C07C 25/18 (2006.01); C07C 215/80 (2006.01); C07D 263/56 (2006.01); C08G 73/22 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 23/29 (2006.01); H01L 27/12 (2006.01); H05K 1/02 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); C07C 25/18 (2013.01); C07C 41/22 (2013.01); C07C 67/307 (2013.01); C07C 209/74 (2013.01); C07C 211/56 (2013.01); C07C 213/00 (2013.01); C07C 215/80 (2013.01); C07C 231/02 (2013.01); C07C 231/12 (2013.01); C07C 269/06 (2013.01); C07D 209/48 (2013.01); C07D 263/56 (2013.01); C07D 263/62 (2013.01); C08G 69/32 (2013.01); C08G 73/106 (2013.01); C08G 73/1017 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1075 (2013.01); C08G 73/1082 (2013.01); C08G 73/22 (2013.01); C09D 179/04 (2013.01); C09D 179/08 (2013.01); G03F 7/037 (2013.01); G03F 7/039 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H01L 21/027 (2013.01); H01L 23/293 (2013.01); H01L 23/3157 (2013.01); H01L 23/3171 (2013.01); H01L 27/1248 (2013.01); H05K 1/0298 (2013.01); H05K 3/3452 (2013.01); H01L 27/3258 (2013.01); H01L 2224/11 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):