The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Oct. 23, 2020
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventor:
Kuo-Tso Chen, Taipei, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/24 (2006.01); H04B 11/00 (2006.01); G01N 29/06 (2006.01); G01N 29/07 (2006.01);
U.S. Cl.
CPC ...
G01N 29/245 (2013.01); G01N 29/0654 (2013.01); G01N 29/07 (2013.01); H04B 11/00 (2013.01); G01N 2291/011 (2013.01); G01N 2291/023 (2013.01); G01N 2291/101 (2013.01);
Abstract
A signal sensing module includes a substrate, a sensing electrode, a piezoresistive material layer and a sensing circuit. The substrate has a surface. The sensing electrode is disposed on the substrate and is exposed from the surface. The piezoresistive material layer is formed on the surface and covers the sensing electrode. The piezoresistive material layer has a resistance value. The sensing circuit is disposed in the substrate and adapted to sense a change of resistance value when a pressure wave passes through the piezoresistive material layer.