The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Aug. 28, 2019
Robert Miles Young, Ellicott City, MD (US);
Aaron Ashley Hathaway, Baltimore, MD (US);
John X. Przybysz, Severna Park, MD (US);
Gregory R. Boyd, Washington, DC (US);
Zachary A. Stegen, Baltimore, MD (US);
Edward R. Engbrecht, Odenton, MD (US);
Aaron A. Pesetski, Gambrills, MD (US);
Marc Eisenzweig Sherwin, Catonsville, MD (US);
Robert Miles Young, Ellicott City, MD (US);
Aaron Ashley Hathaway, Baltimore, MD (US);
John X. Przybysz, Severna Park, MD (US);
Gregory R. Boyd, Washington, DC (US);
Zachary A. Stegen, Baltimore, MD (US);
Edward R. Engbrecht, Odenton, MD (US);
Aaron A. Pesetski, Gambrills, MD (US);
Marc Eisenzweig Sherwin, Catonsville, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.