The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Jan. 06, 2021
Applicant:

Lutron Technology Company Llc, Coopersburg, PA (US);

Inventors:

Ryan M. Bocock, Austin, TX (US);

Robert Bollinger, Jr., Fogelsville, PA (US);

Richard S. Camden, Coopersburg, PA (US);

Kevin L. Gascho, Bethlehem, PA (US);

Robert C. Newman, Jr., Emmaus, PA (US);

Peter W. Ogden, Jr., Austin, TX (US);

Assignee:

Lutron Technology Company LLC, Coopersburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/71 (2015.01); F21V 7/06 (2006.01); H05K 1/02 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/713 (2015.01); F21V 7/06 (2013.01); H05K 1/0204 (2013.01); F21Y 2115/10 (2016.08); H05K 2201/10106 (2013.01);
Abstract

A lighting device (e.g., a controllable light-emitting diode illumination device) may have a light-generation module that may be assembled and calibrated prior to the light-generation module being installed in a finished good. The light-generation module may include an emitter module having at least one emitter mounted to a substrate and configured to emit light. The light-generation module may include a first printed circuit board on which the emitter module may be mounted and a second printed circuit board on which those circuits that are essential for powering the emitter module may be mounted. The light-generation module may include a heat sink located between the first printed circuit board and the second printed circuit board. The emitter module may be thermally-coupled to the heat sink through the substrate and the first printed circuit board.


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