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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11333341 B1

PDFFull Text
Date of Patent:
May. 17, 2022

Filed:

Nov. 12, 2020

Systems and methods for coupling a metal core pcb to a heat sink

Applicant:

Fluence Bioengineering, Inc., Austin, TX (US);

Inventors:

Dung Duong, Austin, TX (US);

Randall Johnson, Austin, TX (US);

Nicholas Klase, Austin, TX (US);

Assignee:

Fluence Bioengineering, Inc., Austin, TX (US);

Attorneys:

Yutian Ling

Shaun P. Montana

Primary Examiner:

Tuyen K Vo

Int. Cl.
CPC ...
F21V 29/00 (2015.01); F21V 21/20 (2006.01); F21V 29/502 (2015.01); F21V 29/76 (2015.01); A01G 9/24 (2006.01); F21V 29/74 (2015.01); F21V 29/75 (2015.01); F21V 23/00 (2015.01); H05K 7/20 (2006.01); F28F 3/02 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01); F21V 29/83 (2015.01); A01G 9/20 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01); F28D 21/00 (2006.01); F21W 131/40 (2006.01); F21Y 103/10 (2016.01); F21V 29/67 (2015.01); F21Y 115/10 (2016.01); F21V 19/00 (2006.01);
U.S. Cl.
CPC ...
F21V 29/502 (2015.01); A01G 9/20 (2013.01); A01G 9/249 (2019.05); F21V 23/009 (2013.01); F21V 29/745 (2015.01); F21V 29/75 (2015.01); F21V 29/76 (2015.01); F21V 29/763 (2015.01); F21V 29/83 (2015.01); F28F 3/02 (2013.01); H01L 23/367 (2013.01); H05K 1/021 (2013.01); H05K 7/20409 (2013.01); F21V 19/0055 (2013.01); F21V 29/67 (2015.01); F21W 2131/40 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); F28D 2021/0029 (2013.01); F28F 3/025 (2013.01); H05K 1/05 (2013.01); H05K 3/0061 (2013.01);
Abstract

Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Find Patent Forward Citations

Duong, Dung. (2022). Systems and methods for coupling a metal core pcb to a heat sink (U.S. Patent No. 11333341). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11333341

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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