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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11332642 B1

PDFFull Text
Date of Patent:
May. 17, 2022

Filed:

Jul. 22, 2020

Assembly layer for flexible display

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Belma Erdogan-Haug, Woodbury, MN (US);

Albert I. Everaerts, Tucson, AZ (US);

David S. Hays, Woodbury, MN (US);

David J. Kinning, Woodbury, MN (US);

Maria A. Appeaning, St. Paul, MN (US);

Jong-Seob Won, Gyeonggi-do, KR;

Ross E. Behling, Woodbury, MN (US);

Jason D. Clapper, Lino Lakes, MN (US);

Marie Aloshyna ep Lesuffleur, Painted Post, NY (US);

Assignee:

3M Innovative Properties Company, St. Paul, MN (US);

Attorney:

Ann K. Gallagher

Primary Examiner:

Robert S Jones, Jr

Int. Cl.
CPC ...
C09J 7/10 (2018.01); B32B 7/12 (2006.01); B32B 27/40 (2006.01); B32B 27/36 (2006.01); B32B 25/14 (2006.01); B32B 27/30 (2006.01); B32B 3/04 (2006.01); B32B 27/32 (2006.01); B32B 27/08 (2006.01); B32B 25/20 (2006.01); B32B 27/28 (2006.01); C09J 7/38 (2018.01); C08G 77/455 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); B32B 3/04 (2013.01); B32B 7/12 (2013.01); B32B 25/14 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C08G 77/455 (2013.01); C09J 7/38 (2018.01); H01L 51/0097 (2013.01); H01L 51/5246 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/26 (2013.01); B32B 2274/00 (2013.01); B32B 2307/412 (2013.01); B32B 2307/542 (2013.01); B32B 2307/546 (2013.01); B32B 2307/548 (2013.01); B32B 2457/12 (2013.01); B32B 2457/20 (2013.01); C09J 2203/318 (2013.01); C09J 2301/312 (2020.08); C09J 2409/00 (2013.01); C09J 2423/00 (2013.01); C09J 2433/00 (2013.01); C09J 2453/00 (2013.01); C09J 2475/00 (2013.01); C09J 2483/00 (2013.01); H01L 2251/5338 (2013.01);
Abstract

The present invention is an assembly layer for a flexible device. Within a temperature range of between about −30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.

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